Polycrystalline Diamond Powder

Product Code:SN20130806161819448
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Polycrystalline Diamond Powder

Polycrystalline Diamond Powder

GRISH detonation polycrystalline diamond (PCD) is similar with natural Carbonado in the structure. Compared with monocrystalline diamond, PCD has more cutting edges, resulting in the higher removal rate, with good self-sharpening properties. The structure will always open new sharp edges introduced by releasing an outer layer of dull crystallites. The polycrystalline diamond can give higher removal rate and lowest level of scratches. That’s why it is especially suitable for the high precision processing on super hard material.


Specification and Application:

Specification

D10(μm)

D50(μm)

D90(μm)

Application

PCD1/8

≥0.06

0.11-0.14

≤0.21

End surface polishing of optical crystal, ultra-hard ceramic, and metal

PCD1/4

≥0.11

0.2-0.25

≤0.40

PCD0-1

≥0.32

0.45-0.55

≤0.95

PCD0.5-1

≥0.50

0.60-0.78

≤1.10

PCD0-2

≥0.50

0.90-1.10

≤2.00

PCD1-3

≥1.10

1.80-2.10

≤3.50

Rough polishing 

PCD2-4

≥1.80

2.70-3.10

≤4.40

Lapping and rough polishing 

PCD3-6

≥2.90

4.00-4.50

≤5.90

PCD4-8

≥3.90

5.20-5.90

≤9.00

Back thinning or lapping of Sapphire 

PCD5-12

≥4.80

7.50-8.50

≤13.00

 Note: Customizations are available upon requests

Features:

1) Keep high removal rate and precision polishing effect without scratches. Especially suitable to ultra-hard material as non-ferrous metals, alloys, tungsten carbides, sapphire and other wear parts.. 

2) Compared with monocrystalline diamond powder, polycrystalline diamond with high toughness, and good self-sharpening properties.

3) High wear ability and long service life.

 

Field of application:

1.sapphire substrate lapping and polishing ;Light-emtiting diode substrate lapping;crude substrate wafer abrasive slurry ;substrate polishing slurry;sapphire diapgragm/window wafer lapping and polishing;optical cystal lapping and polishing ;watch dial plate grinding/polishing ;mobile/cell phone glass/sapphire pannel lapping and polishing;zinc selenide grinding and polishing;

 

2.Iphone5 camera lens lapping and polishing;hard disk heads lapping and polishing;Hard disk lapping and polishing;high lapping rate ratio;minimal scratch;high degree of uniformity and smoothness ;Zinc selenide lapping;laser crystal polishing;glass/optics polishing ;metal lapping/grinding ;aluminum alloy lapping/grinding ;stainless steel lapping/grinding;

 

3.diamond based tools;tungsten carbide lapping/grinding ;mould lapping/grinding ;mould polishing;(micro) powder;ceramic grinding/lapping ;mobile phone shell/case lapping;

 

Polycrystalline Diamond Powder

 
Sapphire Wafer Optical Glass